Product Details:
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Material: | SiC | Composition:SiC: | >85% |
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Color: | Black | Density: | ≥3.65g/cm3 |
Max. Service Temp: | 1380℃ | Flexural Strength: | 250MPa |
Hardness: | ≥84HRA | Water Absorption: | ≤0.2% |
Abrasion: | < 0.02% | Bending Strength: | ≥290MPa |
Highlight: | 99.99% Alumina Ceramic End Effectors,Semiconductor Ceramic End Effectors,Al2O3 Ceramic End Effectors |
High-Performance Ceramic End Effectors Revolutionize Semiconductor Manufacturing
Superior heat resistance and plasma resistance are ideal for semiconductor processing equipment.
Aluminum Oxide material, featuring extremely high purity (up to 99.99%), excellent plasma resistance and heat resistance, and restricted particle occurrence, is used in semiconductor processing equipment parts, including structural components and tools.
The use of ceramics in the semiconductor industry is increasing due to the desirable combinations of electrical, mechanical and physical properties often found in ceramics. As integrated circuit manufacturers strive to make their chips faster, smaller and less expensive, semiconductor fabrication equipment companies become more dependent on advanced ceramic components to achieve the desired performance.
The manufacture of ceramics for the semiconductor industry is typical of standard structural ceramics manufacturing, using traditional forming and densification methods. The biggest difference is the high purity requirement of the ceramic, and occasionally the very tight control over electrical properties.
Manufacturing Processes:
Quality Control:
Contact Person: Ms. Yuki
Tel: 8615517781293