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Pure BN99 Boron Nitride Ring Hot Pressed Aluminum Nitride Plate

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Pure BN99 Boron Nitride Ring Hot Pressed Aluminum Nitride Plate

Pure BN99 Boron Nitride Ring Hot Pressed Aluminum Nitride Plate
Pure BN99 Boron Nitride Ring Hot Pressed Aluminum Nitride Plate Pure BN99 Boron Nitride Ring Hot Pressed Aluminum Nitride Plate Pure BN99 Boron Nitride Ring Hot Pressed Aluminum Nitride Plate Pure BN99 Boron Nitride Ring Hot Pressed Aluminum Nitride Plate

Large Image :  Pure BN99 Boron Nitride Ring Hot Pressed Aluminum Nitride Plate

Product Details:
Place of Origin: China
Brand Name: KEGU
Model Number: Customizable
Payment & Shipping Terms:
Price: 200-500 yuan/kg
Packaging Details: Strong wooden box for Global shipping
Payment Terms: L/C,D/A,D/P,T/T,Western Union,MoneyGram
Supply Ability: 2,000 pcs/month

Pure BN99 Boron Nitride Ring Hot Pressed Aluminum Nitride Plate

Description
Feature: Boron Nitride Crucibl Composition: BN>99%
Attribute: Pyrolytic Boron Nitride Crucible Advantage: Stable
Corrosion Resistance: Excellent Compressive Strength: 200-300 MPa
Maximum Operating Temperature: 1000-1800°C Working Temperature: About 2200 Celsius Degree
Chemical Inertness: High Color: White
Shape: Irregular Thermal Conductivity: 30-40 W/mK
Volume Resistivity: 1014-1015 Ω·cm Usage: Gas Atomization
Material: Boron Nitride
Highlight:

BN99 Boron Nitride Ring

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Hot Pressed Boron Nitride Ring

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BN99 Aluminum Nitride Plate

Pure BN99 Boron Nitride Ring Hot Pressed Aluminum Nitride Plate

 

We provide standard products & tailor-made products for hot-pressed boron nitride ring. Except for pure BN99 ring, we also supply BN composites with silicon carbide, calcium borate, aluminum nitride and zirconia, to fulfill various of demand for the customers. Check the boron nitride specifications for our pure BN99 and zirconia composite material ZSBN.

 

Materials Properties:

Pure BN99 Boron Nitride Ring Hot Pressed Aluminum Nitride Plate 0

Main aoolications:

  • Components for semiconductor equipment
  • Plates, Wafer, Rings, Gas distribution plates, Nozzles
  • Top nozzles or Baffles, Pedestal heaters, Cover plates
  • RF windows, Crucibles
  • Substrate
  • Heat resistant base materials

 

Key Features & Specifications

  • Utilizes hot pressing technology
  • Up to diameter of 650mm
  • Very low porosity
  • High themal conductivity
  • Ultra chemical resistant
  • Direct sintered to allow for net shape sintering

Manufacturing Processes:

Pure BN99 Boron Nitride Ring Hot Pressed Aluminum Nitride Plate 1

Quality Control:

Pure BN99 Boron Nitride Ring Hot Pressed Aluminum Nitride Plate 2

Contact Details
Shaanxi KeGu New Material Technology Co., Ltd

Contact Person: Ms. Yuki

Tel: 8615517781293

Send your inquiry directly to us (0 / 3000)