Product Details:
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Material: | SiC | Composition:SiC: | >85% |
---|---|---|---|
Color: | Black | Density: | ≥3.65g/cm3 |
Max. Service Temp: | 1380℃ | Flexural Strength: | 250MPa |
Hardness: | ≥84HRA | Water Absorption: | ≤0.2% |
Abrasion: | < 0.02% | Bending Strength: | ≥290MPa |
Highlight: | White Aluminum Oxide Ceramics,0.8g/Cm3 Aluminum Oxide Ceramics,Wafer Grinding Alumina Ceramic Plate |
● Specification
WCA | WCA-3 | ||
Al2O3 | % | ≥99.5 | ≥99.5 |
Original Crystal | μm | 10-20 | ~3.0 |
Density | g/cm3 | ≥0.8 | ≥0.6 |
Oil Absorption | % | ≤65 | ≤75 |
Shape | plate | ||
Application |
Used for mirror finish polishing in the electronics industry, etc. |
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Appreance | White powder |
Application:
lapping and polishing of semiconductor monocrystalline silicon wafers and crystal wafers and polishing of mobile phone metal casings.
Quality control:
Features:
Contact Person: Ms. Yuki
Tel: 8615517781293