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Silicon Carbide Block for Grinding Semiconductor Silicon Wafer / Led Sapphire Wafer

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NGK values our long-standing partnership with Shaanxi Kegu. Their SSiC ceramics excel in quality and innovation, driving our mutual success. Here’s to continued collaboration!

—— NGK Thermal Technology Co.,Ltd

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Silicon Carbide Block for Grinding Semiconductor Silicon Wafer / Led Sapphire Wafer

Silicon Carbide Block for Grinding Semiconductor Silicon Wafer / Led Sapphire Wafer
Silicon Carbide Block for Grinding Semiconductor Silicon Wafer / Led Sapphire Wafer Silicon Carbide Block for Grinding Semiconductor Silicon Wafer / Led Sapphire Wafer Silicon Carbide Block for Grinding Semiconductor Silicon Wafer / Led Sapphire Wafer Silicon Carbide Block for Grinding Semiconductor Silicon Wafer / Led Sapphire Wafer

Large Image :  Silicon Carbide Block for Grinding Semiconductor Silicon Wafer / Led Sapphire Wafer

Product Details:
Place of Origin: China
Brand Name: KeGu
Model Number: Customizable
Payment & Shipping Terms:
Price: 200-500 yuan/kg
Packaging Details: Strong wooden box for Global shipping
Payment Terms: L/C,D/A,D/P,T/T,Western Union,MoneyGram
Supply Ability: 2,000 pcs/month
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Silicon Carbide Block for Grinding Semiconductor Silicon Wafer / Led Sapphire Wafer

Description
Material: SiC Composition:SiC: >98%
Color: Black Density: >3.05g/cm3
Max. Service Temp: 1650°C Flexural Strength: 380MPa
Highlight:

Grinding Silicon Carbide Block

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Led Wafer Grinding Silicon Carbide Block

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Semiconductor Silicon Wafer SIC Block

Silicon Carbide Block, Grinding Process Of Semiconductor Silicon Wafer, Led Sapphire Wafer, Led Wafer

 

Description:

Silicon Carbide Block Good Thermal Conductivity Good Thermal Shock Resistance Good Abrasion Resistance

Due to our large output capacity and strong molding ability for customization production, our company has exported our products to many international markets. Our products are certified according to requirements of customers.

We continue to innovate, improve, and enhance as well as integrate the resources internally and externally to strengthen the flexibility of our company and the competitiveness of our products, and provide both old and new customers with best service.

 


Application:

  1. Grinding process of semiconductor silicon wafer

  2. Grinding process of LED sapphire wafer

  3. Thinning process of LED wafer


Feature requirements:

  1. Good thermal conductivity

  2. Good thermal shock resistance

  3. Good abrasion resistance

 

Performance UNIT HS-A HS-P HS-XA
Grain Size μm 4-10 4-10 4-10
Density g/cm ≥3.1 3.0-3.1 >3.1
Hardness (Knoop) Kg/mm² 2800 2800 2800
Flexural Strength 4 pt @ RT MPa*m1/2 385 240 420
*10³1b/in² 55 55 55
Compressive Strength @ RT Mpa 3900 　 3900
*10³1b/in² 560 560
Modulus of Elasticity @ RT Gpa 410 400 410
*10³1b/in² 59 58 59
Weibull Modulus (2 parameter) 　 8 19 12
Poisson Ratio 　 0.14 0.14 0.14
Fracture Toughness @ RT Double Torsion & SENB MPa*m1/2 8 8 8
*1³1b/in²in½
Coefficient of Thermal Expansion RT to 700℃ X10-6mm/mmK 4.02 4.2 4.02
X10-6 in/in°F 2.2 2.3 2.2
Maximum Service Temp.Air Mean Specific Heat @ RT °C 1900 1900 1900
J/gmK 0.67 0.59 0.67
Thermal Conductivity @ RT W/mK 125.6 110 125.6
Btu/ft h°F 72.6 64 72.6
@200°C W/mK 102.6 　 102.6
Btu/ft h°F 59.3 59.3
@400°C W/mK 77.5 　 77.5
Btu/ft h°F 44.8 44.8
Permeability @ RT to 1000°C 31MPa below No gas leakage
Electrical Resistivity @ RT Ohm-cm 102-106 N/A 102-106
Emissivity 　 0.9 0.9 0.9

 


Why better than others:

 

  1. Stable quality and fast delivery

  2. SiC block diameter from 120mm to 480mm in stock

  3. Save time of sample loading and unloading process

  4. Acceptable higher thinning rate

  5. Available in various specifications, also provide customized services

 

 

 

Tag:

Silicon Carbide Ceramics,

Pressureless Sintered SIC,

SIC Ceramics

Contact Details
Shaanxi KeGu New Material Technology Co., Ltd

Contact Person: Ms. Yuki

Tel: 8615517781293

Send your inquiry directly to us (0 / 3000)

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