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High Thermal Conductivity Boron Nitride Ceramic HBN Components for Exceptional Temperature Resistance and Large Component Capability

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High Thermal Conductivity Boron Nitride Ceramic HBN Components for Exceptional Temperature Resistance and Large Component Capability

High Thermal Conductivity Boron Nitride Ceramic HBN Components for Exceptional Temperature Resistance and Large Component Capability
High Thermal Conductivity Boron Nitride Ceramic HBN Components for Exceptional Temperature Resistance and Large Component Capability High Thermal Conductivity Boron Nitride Ceramic HBN Components for Exceptional Temperature Resistance and Large Component Capability High Thermal Conductivity Boron Nitride Ceramic HBN Components for Exceptional Temperature Resistance and Large Component Capability High Thermal Conductivity Boron Nitride Ceramic HBN Components for Exceptional Temperature Resistance and Large Component Capability High Thermal Conductivity Boron Nitride Ceramic HBN Components for Exceptional Temperature Resistance and Large Component Capability

Large Image :  High Thermal Conductivity Boron Nitride Ceramic HBN Components for Exceptional Temperature Resistance and Large Component Capability

Product Details:
Place of Origin: China
Brand Name: KEGU
Model Number: Customizable
Payment & Shipping Terms:
Price: 200-500 yuan/kg
Packaging Details: Strong wooden box for Global shipping
Payment Terms: L/C,D/A,D/P,T/T,Western Union,MoneyGram
Supply Ability: 2,000 pcs/month
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High Thermal Conductivity Boron Nitride Ceramic HBN Components for Exceptional Temperature Resistance and Large Component Capability

Description
Working Temperature: About 2200 Celsius Degree Thermal Conductivity: 30-50 W/mK
Attribute: Pyrolytic Boron Nitride Crucible Color: White
Advantage: Stable Thermal Shock Resistance: Good
Chemical Resistance: Excellent Hardness: 9 Mohs
Application: Industry Ceramic Dielectric Strength: 20-30 KV/mm
Feature: Ceramic Crucible Type: Ceramic Parts
Dielectric Constant: 4-5 Material: Boron Nitride
Density: 2.2-2.3 G/cm3
Highlight:

Boron Nitride Ceramic Nozzles

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Gas Atomization Boron Nitride Ceramic

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Amorphous BN Ceramic Nozzles

Hexagonal Boron Nitride (HBN) Ceramics for Semiconductor Applications
Hexagonal Boron Nitride (HBN) ceramics deliver exceptional thermal management and electrical insulation for demanding semiconductor manufacturing processes. With graphite-like structure but superior performance, our "white graphite" components maintain structural integrity in extreme temperatures while providing excellent heat dissipation - making them ideal for critical semiconductor equipment applications.
Key Technical Advantages & Performance Features
  • Superior Thermal Management: High thermal conductivity ensures efficient heat dissipation in extreme processing environments
  • Exceptional Temperature Resistance: Maintains structural integrity and performance stability at elevated temperatures exceeding 2000°C
  • Large Component Capability: Advanced hot pressing technology enables production of large-dimension components up to 650mm diameter
  • Enhanced Material Durability: Very low porosity structure provides superior chemical resistance against corrosive semiconductor processing environments
  • Precision Manufacturing Ready: Mohs hardness of 2 allows easy machining into complex geometries with minimal post-processing
  • Net Shape Production: Direct sintering capability reduces material waste and manufacturing costs
Primary Semiconductor Equipment Applications
Gas Distribution & Process Components
  • Gas distribution plates & spray nozzles
  • Top nozzles and baffle assemblies
  • Pedestal heaters & cover plates
High-Temperature Processing Components
  • RF windows & evaporation crucibles
  • Wafer processing components & rings
  • Heat resistant substrates & base materials
Why Choose Our Boron Nitride Ceramics?
Our HBN components are precision-engineered for reliability in the most demanding semiconductor fabrication environments. The unique combination of net-shape sintering capability, large diameter manufacturing (up to 650mm), and exceptional thermal properties makes them the optimal choice for:
  • High-temperature thermal management systems
  • Corrosive environment applications
  • Precision semiconductor manufacturing
  • Custom-shaped components requiring minimal post-processing
Technical Highlights
Boron nitride ceramics for semiconductor equipment
HBN components with 650mm diameter capability
White graphite for high-temperature applications
Thermally conductive electrical insulators
Corrosion-resistant semiconductor components
High Thermal Conductivity Boron Nitride Ceramic HBN Components for Exceptional Temperature Resistance and Large Component Capability 0 High Thermal Conductivity Boron Nitride Ceramic HBN Components for Exceptional Temperature Resistance and Large Component Capability 1

Tag:

BN Ceramic,

Hexagonal Boron Nitride,

Boron Nitride Ceramic

Contact Details
Shaanxi KeGu New Material Technology Co., Ltd

Contact Person: Ms. Yuki

Tel: 8615517781293

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