What are Boron Nitride Ceramics? | HBN Components for Semiconductor Applications

Product Description

Hexagonal Boron Nitride (HBN) ceramics deliver exceptional thermal management and electrical insulation for demanding semiconductor manufacturing processes. With graphite-like structure but superior performance, our "white graphite" components maintain structural integrity in extreme temperatures while providing excellent heat dissipation - making them ideal for critical semiconductor equipment applications.

Key Technical Advantages & Performance Features

• Superior Thermal Management: High thermal conductivity ensures efficient heat dissipation in extreme processing environments

• Exceptional Temperature Resistance: Maintains structural integrity and performance stability at elevated temperatures exceeding 2000°C

• Large Component Capability: Advanced hot pressing technology enables production of large-dimension components up to 650mm diameter

• Enhanced Material Durability: Very low porosity structure provides superior chemical resistance against corrosive semiconductor processing environments

• Precision Manufacturing Ready: Mohs hardness of 2 allows easy machining into complex geometries with minimal post-processing

• Net Shape Production: Direct sintering capability reduces material waste and manufacturing costs

Primary Semiconductor Equipment Applications

Gas Distribution & Process Components

• Gas distribution plates & spray nozzles

• Top nozzles and baffle assemblies

• Pedestal heaters & cover plates

High-Temperature Processing Components

• RF windows & evaporation crucibles

• Wafer processing components & rings

• Heat resistant substrates & base materials

Why Choose Our Boron Nitride Ceramics?

Our HBN components are precision-engineered for reliability in the most demanding semiconductor fabrication environments. The unique combination of net-shape sintering capability, large diameter manufacturing (up to 650mm), and exceptional thermal properties makes them the optimal choice for:

• High-temperature thermal management systems

• Corrosive environment applications

• Precision semiconductor manufacturing

• Custom-shaped components requiring minimal post-processing

Search-Optimized Technical Highlights

• Boron nitride ceramics for semiconductor equipment

• HBN components with 650mm diameter capability

• White graphite for high-temperature applications

• Thermally conductive electrical insulators

• Corrosion-resistant semiconductor components