High-Performance Aluminum Nitride Ceramic Parts with Exceptional Thermal Conductivity and Superior Electrical Insulation for Controlled Thermal Expansion
Basic Properties
Place of Origin:
China
Brand Name:
KEGU
Model Number:
Customizable
Trading Properties
Price:
200-500 yuan/kg
Payment Terms:
L/C,D/A,D/P,T/T,Western Union,MoneyGram
Supply Ability:
2,000 pcs/month
Product Summary
High-Performance Aluminum Nitride (AlN) Ceramic Parts for Thermal Management & Electronics Aluminum Nitride (AlN) stands alone as the premier technical ceramic material, uniquely combining exceptional thermal conductivity with superior electrical insulation properties. This rare combination makes it ...
Product Details
Highlight:
AlN Aluminum Nitride Parts
,Semiconductor Equipment Aluminum Nitride Parts
,AlN Semiconductor Equipment Parts
Material:
SiC
Composition:SiC:
＞85%
Color:
Black
Density:
≥3.65g/cm3
Max. Service Temp:
1380℃
Flexural Strength:
250MPa
Hardness:
≥84HRA
Water Absorption:
≤0.2%
Abrasion:
< 0.02%
Bending Strength:
≥290MPa
Product Description
High-Performance Aluminum Nitride (AlN) Ceramic Parts for Thermal Management & Electronics
Aluminum Nitride (AlN) stands alone as the premier technical ceramic material, uniquely combining exceptional thermal conductivity with superior electrical insulation properties. This rare combination makes it the ideal material solution for high-power electronics, advanced semiconductor processing, and demanding thermal management applications.
Key Material Properties & Advantages
- Exceptional Thermal Conductivity (180-220 W/m*K)
- Rapidly dissipates heat from critical components
- Enables higher power densities and improved device reliability
- Excellent Electrical Insulation
- High dielectric strength and volume resistivity
- Prevents current leakage in high-voltage applications
- Controlled Thermal Expansion
- CTE closely matches silicon (4.7-5.6 * 10⁻⁶/K)
- Reduces thermal stress in semiconductor packages
- Superior Metallization Capability
- Compatible with thick-film and thin-film processes
- Enables robust brazing and bonding solutions
Advanced Manufacturing Processes
We employ multiple forming technologies to produce precision AlN components:
- Dry Pressing: Cost-effective for high-volume, simple geometries
- Cold Isostatic Pressing (CIP): Superior density for complex shapes
- Tape Casting: Ideal for thin substrates and multilayer structures
- Extrusion: Suitable for long, continuous profiles
Applications Across Industries
Semiconductor Manufacturing
- Etch chamber components
- Plasma shower heads
- Wafer processing fixtures
Power Electronics & LED
- High-power ceramic substrates
- LED heat sinks and packages
- IGBT modules and power devices
Thermal Management Systems
- Heat spreaders and dissipators
- Thermal interface materials
- Cooling system components
Electrical Insulation
- High-voltage insulators
- RF microwave packages
- Electrical bushings and spacers
Why Choose Our Aluminum Nitride Components?
- Material Expertise: Deep understanding of AlN properties and processing
- Precision Manufacturing: Tight tolerances and superior surface finishes
- Custom Solutions: Tailored components for specific application requirements
- Quality Assurance: Rigorous testing and quality control procedures
Need AlN components for your thermal management challenge? Contact our engineering team to discuss how our Aluminum Nitride solutions can enhance your product performance and reliability.
Miss. Scarlett.S
Deputy Head of Foreign Trade Department
- Email: scarlett.s@kegugroup.com
- Tel: 8616602956098
- WhatsApp: 8613390790728
-
WeChat:
Scarlettseren533
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