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Black OEM Si3N4 Silicon Nitride Ceramic Structural Part with High Thermal Conductivity and Flexural Strength Customizable for Industrial Applications

Basic Properties
Place of Origin: China
Brand Name: KEGU
Model Number: Customizable
Trading Properties
Price: 200-500 yuan/kg
Payment Terms: L/C,D/A,D/P,T/T,Western Union,MoneyGram
Supply Ability: 2,000 pcs/month
Product Summary
Black OEM Si3N4 Silicon Nitride Ceramics Non Standard Structural High-performance silicon nitride ceramic materials developed for the aluminum industry offer significantly improved thermal and mechanical properties compared to similar products. The "L-shaped high thermal conductivity submerged ...

Product Details

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Non Standard Silicon Nitride Ceramic

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High Thermal Conductivity Si3N4 Ceramic

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High Temperature Resistant Structural Ceramic

Material: Silicon Nitride
Composition:SiC: >85%
Color: Black
Density: 3.20-3.26g/cm3
Max. Service Temp: 1450℃
Flexural Strength: 250MPa
Sample: Customizable
Chemical Stability: High
Apparent Porosity: 0-0.1%
Elastic Modulus: 300-320GPa
Compression Strength: >1500MPa
Vickers Hardness(hv0.5): 15-16GPa
Thermal Conductivity: 20-25W/(m.k)
Specific Resistivity: 10^14Ω·cm
Product Description
Black OEM Si3N4 Silicon Nitride Ceramics Non Standard Structural
High-performance silicon nitride ceramic materials developed for the aluminum industry offer significantly improved thermal and mechanical properties compared to similar products. The "L-shaped high thermal conductivity submerged heating appliance" represents revolutionary progress for aluminum industrial equipment.
Special structural parts requiring exceptional thermal shock resistance represent a key growth area for silicon nitride ceramic materials. In applications involving high temperatures, strong corrosion resistance, and extreme wear resistance, silicon nitride ceramics are increasingly replacing materials such as cemented carbide, alumina, zirconia, and silicon carbide.
Black OEM Si3N4 Silicon Nitride Ceramics Non Standard Structural component
Silicon Nitride Material Properties Comparison
Main component 99%Al2O3 S-SiC ZrO2 Si3N4
Physical Properties
Density 3.9 g/cm³ 3.1 g/cm³ 6 g/cm³ 3.2 g/cm³
Water Absorption 0% 0.1% 0% 0.1%
Sinter Temperature 1700°C 2200°C 1500°C 1800°C
Mechanical Properties
Rockwell Hardness 1700 HV 2200 HV 1300 HV 1400 HV
Bend Strength 3500 kgf/mm² 4000 kgf/mm² 9000 kgf/mm² 7000 kgf/mm²
Compression Intensity 30000 kgf/mm² 20000 kgf/mm² 20000 kgf/mm² 23000 kgf/mm²
Thermal Properties
Maximum working temperature 1500°C 1600°C 1300°C 1400°C
Thermal expansion coefficient (0-1000°C) 8.0×10⁻⁶/°C 4.1×10⁻⁶/°C (0-500°C)
5.2×10⁻⁶/°C (500-1000°C)
9.5×10⁻⁶/°C 2.0×10⁻⁶/°C (0-500°C)
4.0×10⁻⁶/°C (500-1000°C)
Thermal Shock resistance 200°C 250°C 300°C 400-500°C
Thermal Conductivity 31 W/m·K (25°C)
16 W/m·K (300°C)
100 W/m·K (25°C)
100 W/m·K (300°C)
3 W/m·K (25°C)
3 W/m·K (300°C)
25 W/m·K (25°C)
25 W/m·K (300°C)
Electrical Properties
Resistivity (Volume) >10¹² Ω·cm (20°C)
10¹²-10¹³ Ω·cm (100°C)
>10¹² Ω·cm (300°C)
10⁶-10⁸ Ω·cm (20°C) >10¹⁰ Ω·cm (20°C) >10¹¹ Ω·cm (20°C)
>10¹¹ Ω·cm (100°C)
>10¹¹ Ω·cm (300°C)
Insulation Breakdown Intensity 18 kV/mm semiconductor 9 kV/mm 17.7 kV/mm
Dielectric Constant (1 MHz) 10 (E) - 29 7
Dielectric Dissipation 0.4×10⁻³ (tg o) - - -
Silicon Nitride ceramic material properties diagram
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