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High Purity Approximate Spherical Alpha Alumina Powder with Controlled Particle Size and Optimized Morphology for Thermal Conduction

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High Purity Approximate Spherical Alpha Alumina Powder with Controlled Particle Size and Optimized Morphology for Thermal Conduction

High Purity Approximate Spherical Alpha Alumina Powder with Controlled Particle Size and Optimized Morphology for Thermal Conduction
High Purity Approximate Spherical Alpha Alumina Powder with Controlled Particle Size and Optimized Morphology for Thermal Conduction High Purity Approximate Spherical Alpha Alumina Powder with Controlled Particle Size and Optimized Morphology for Thermal Conduction High Purity Approximate Spherical Alpha Alumina Powder with Controlled Particle Size and Optimized Morphology for Thermal Conduction High Purity Approximate Spherical Alpha Alumina Powder with Controlled Particle Size and Optimized Morphology for Thermal Conduction

Large Image :  High Purity Approximate Spherical Alpha Alumina Powder with Controlled Particle Size and Optimized Morphology for Thermal Conduction

Product Details:
Place of Origin: China
Brand Name: KEGU
Model Number: Customizable
Payment & Shipping Terms:
Price: 200-500 yuan/kg
Packaging Details: Strong wooden box for Global shipping
Payment Terms: L/C,D/A,D/P,T/T,Western Union,MoneyGram
Supply Ability: 2,000 pcs/month
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High Purity Approximate Spherical Alpha Alumina Powder with Controlled Particle Size and Optimized Morphology for Thermal Conduction

Description
Material: SiC Composition:SiC: ＞85%
Color: Black Density: ≥3.65g/cm3
Max. Service Temp: 1380℃ Flexural Strength: 250MPa
Hardness: ≥84HRA Water Absorption: ≤0.2%
Abrasion: < 0.02% Bending Strength: ≥290MPa
Highlight:

Spherical Alpha Alumina Powder

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Alpha Alumina Powder D50

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Alpha Alumina Powder 20um

Approximate Spherical Alpha Alumina Powder | High-Purity Thermal Conduction Filler
Enhance Thermal Management with Precision-Engineered Alumina Fillers

Our high-purity approximate spherical alpha alumina powder is specifically formulated to maximize thermal conductivity in polymer composites and thermal interface materials. With controlled particle size distribution and exceptional purity, this advanced ceramic filler enables superior heat dissipation in demanding electronic applications.

Technical Specifications
Parameter Unit SW-2 SW-5 SW-8 SW-15 SW-20
Al₂O₃ Content % ≥99.5 ≥99.5 ≥99.5 ≥99.5 ≥99.5
SiO₂ % ≤0.10 ≤0.08 ≤0.08 ≤0.08 ≤0.08
Fe₂O₃ % ≤0.03 ≤0.03 ≤0.03 ≤0.03 ≤0.03
Na₂O % ≤0.10 ≤0.10 ≤0.10 ≤0.10 ≤0.10
LOI % ≤0.10 ≤0.10 ≤0.10 ≤0.10 ≤0.10
H₂O % ≤0.10 ≤0.10 ≤0.10 ≤0.10 ≤0.10
D50 μm 3.0±0.5 6.5±0.5 9.0±2.0 13.0±2.0 20.0±2.0
Density g/cm³ 0.6±0.2 0.9±0.2 1.0±0.2 1.0±0.2 1.2±0.2
Oil Absorption % ≤45 ≤40 ≤35 ≤30 ≤30
Key Features & Benefits
  • High Purity Composition: ≥99.5% Al₂O₃ content ensures optimal thermal performance and electrical insulation
  • Optimized Particle Morphology: Approximately spherical shape enables higher packing density and improved flow characteristics
  • Controlled Particle Size Distribution: Multiple D50 grades from 3μm to 20μm allow for precise formulation optimization
  • Reduced Oil Absorption: Lower resin demand enables higher filler loading and enhanced thermal conductivity
  • Excellent Filling Performance: Designed to maximize particle concentration in composite materials
Primary Applications
  • Thermal Interface Materials: High-performance thermal greases, gap fillers, and thermally conductive gels
  • Thermal Management Systems: Thermally conductive gaskets, pads, and phase change materials
  • Electronic Packaging: Epoxy molding compounds, underfill materials, and encapsulants
  • Polymer Composites: Thermally conductive plastics, adhesives, and potting compounds
Why Choose Our Alpha Alumina?
  • Enhanced Thermal Conductivity: High purity and optimized morphology directly improve heat transfer efficiency
  • Process Compatibility: Excellent dispersion characteristics simplify manufacturing processes
  • Formulation Flexibility: Multiple size options enable bimodal or multimodal distribution designs
  • Reliable Performance: Consistent batch-to-batch quality ensures predictable composite properties
High Purity Approximate Spherical Alpha Alumina Powder with Controlled Particle Size and Optimized Morphology for Thermal Conduction 0

Tag:

Alumina Catalyst Carrier,

Alumina Ceramic Substrates,

Alumina Ceramic

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Shaanxi KeGu New Material Technology Co., Ltd

Contact Person: Ms. Yuki

Tel: 8615517781293

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