High-Purity Spherical Alumina Powder - White D50 Powder with 3.60 g/cm³ Specific Gravity for Thermal Interface Materials

Product Description

This premium spherical alumina powder features exceptional globularity and high thermal conductivity, manufactured through advanced high-temperature melting technology. With its unique spherical morphology and high α-Al₂O₃ content, it delivers superior performance as a functional filler in thermal interface materials, ceramic composites, and electronic packaging applications.

Technical Specifications

Available Particle Size Distributions

Physical Properties

• Appearance: White free-flowing powder

• Specific Gravity: 3.60 g/cm³

• Melting Point: 2050°C

• Moisture Content: ≤ 0.05%

• Electrical Conductivity: ≤ 10 μS/cm

• pH Value: 7.0 ± 0.5

• α-Al₂O₃ Content: ≥ 90%

• Sphericity Ratio: ≥ 95%

Chemical Composition (All Types)

• Al₂O₃: ≥ 99.0%

• SiO₂: ≤ 0.05%

• Fe₂O₃: ≤ 0.05%

• Na₂O: ≤ 0.02-0.03%

• Other Oxides (K₂O, MgO, CaO): ≤ 0.01-0.02%

Key Performance Characteristics

High Packing Density

• Optimized particle size distribution enables dense packing in polymers and ceramics

• Results in compounds with lower viscosity and improved flow characteristics

Enhanced Thermal Conductivity

• Superior packing efficiency creates effective heat transfer pathways

• Enables formulation of high thermal conductivity composites (2-10 W/m·K)

• Outperforms conventional crystalline silica fillers

Reduced Equipment Wear

• Perfect spherical morphology minimizes abrasion to processing equipment

• Extends service life of mixing, molding, and extrusion machinery

Excellent Electrical Properties

• Low moisture content and electrical conductivity

• Suitable for demanding electronic applications

Primary Applications

Thermal Management Materials

• Fillers for thermal grease, phase change materials, and thermal pads

• Heat sink composites and thermal interface materials

• MC (Metal Core) PCB thermal filling compounds

Electronic Packaging

• Semiconductor encapsulation resins

• Silicone-based thermal adhesives

• Potting compounds for electronic components

Advanced Ceramics & Composites

• Ceramic molding compounds

• High-performance refractory materials

• Technical ceramic formulations

Competitive Advantages

• Superior Sphericity (>95%) for optimal flow and packing

• High Purity (99% Al₂O₃) for demanding applications

• Controlled Particle Size distributions for specific formulation needs

• Proven Performance in thermal interface materials and electronic composites

Looking to enhance your material's thermal performance? Contact our technical team for product samples and application guidance tailored to your specific requirements.