0.8g/cm³ White Aluminum Oxide Ceramic Plate | Wafer Grinding & Polishing

Product Description

Low-density (0.8g/cm³) white alumina ceramic plate for precision grinding. Achieves mirror finishes on semiconductor wafers & metal casings without scratching. Request specs.

Low-Density White Aluminum Oxide Ceramic Plate for Precision Grinding and Polishing

Engineered for ultra-precise surface finishing, our white aluminum oxide ceramic plate is the material of choice for achieving flawless, scratch-free mirror finishes on high-value components. With an exceptionally low density and unique plate-like crystal structure, it delivers superior performance in the most demanding semiconductor and advanced manufacturing applications.

Key Features and Benefits

• Scratch-Free Finishing: The smooth, plate-like crystal morphology glides over surfaces, effectively minimizing the risk of micro-scratches and surface defects.

• High Grinding Efficiency: Combines high hardness with a narrow particle size distribution for strong, consistent, and controllable material removal.

• Optimized for Electronics Manufacturing: High-purity (≥99.5% Al₂O₃) and chemically inert, ensuring no contamination of sensitive materials like silicon wafers.

• Low Density & Controlled Porosity: The porous structure (≥0.8 g/cm³) contributes to a lighter weight and can be engineered for specific coolant or slurry retention needs.

Technical Specifications

Primary Applications

This specialized alumina ceramic is ideally suited for:

• Semiconductor Manufacturing: Lapping and polishing of monocrystalline silicon wafers and other crystal wafers.

• Consumer Electronics: High-gloss mirror polishing of mobile phone metal casings and other precision components.

• Advanced Optics: Finishing of glass and crystalline materials where surface integrity is critical.

Why Choose Our Alumina Ceramic Plate?

In precision grinding, the abrasive material is as critical as the equipment. Our product is specifically designed to solve the core challenge of achieving high material removal rates without compromising surface quality. The unique combination of high purity, plate-like crystals, and low density makes it an indispensable tool for manufacturers who cannot afford surface scratches or contamination.

Explore Our Grinding Solutions

We offer different grades (like WCA and WCA-3) to match your specific process requirements, from coarser lapping to final fine polishing.

Contact us today to discuss your application and request technical data sheets or samples.