High-Performance Ceramic Substrates: Alumina (Al2O3), Aluminum Nitride (AlN), and Silicon Nitride (Si3N4) for Thermal Management and Electrical Insulation
Basic Properties
Place of Origin:
China
Brand Name:
KEGU
Model Number:
Customizable
Trading Properties
Price:
200-500 yuan/kg
Payment Terms:
L/C,D/A,D/P,T/T,Western Union,MoneyGram
Supply Ability:
2,000 pcs/month
Product Summary
High-Performance Ceramic Substrates: Alumina (Al2O3), Aluminum Nitride (AlN), & Silicon Nitride (Si3N4) Ceramic substrates are critical components in modern electronics, providing the essential foundation for circuits while managing heat and ensuring electrical insulation. Among the most widely used ...
Product Details
Highlight:
11 Gpa Aluminum Nitride Ceramic
,Electronics Industry Aluminum Nitride Substrates
,11 Gpa Aluminum Nitride Substrates
Material:
SiC
Composition:SiC:
＞85%
Color:
Black
Density:
≥3.65g/cm3
Max. Service Temp:
1380℃
Flexural Strength:
250MPa
Hardness:
≥84HRA
Water Absorption:
≤0.2%
Abrasion:
< 0.02%
Bending Strength:
≥290MPa
Product Description
High-Performance Ceramic Substrates: Alumina (Al2O3), Aluminum Nitride (AlN), & Silicon Nitride (Si3N4)
Ceramic substrates are critical components in modern electronics, providing the essential foundation for circuits while managing heat and ensuring electrical insulation. Among the most widely used materials are Alumina (Al2O3), Aluminum Nitride (AlN), and Silicon Nitride (Si3N4), each offering a unique set of properties for demanding applications.
Ceramic Substrates Property Comparison
| Characteristic / Material | Al2O3 96% | Al2O3 99.6% | AIN | Si3N4 |
|---|---|---|---|---|
| Apparent Density (g/cm³) | 3.7-3.8 | 3.8-3.9 | 3.3 | 3.5 |
| Vickers Hardness (GPa) | 16 | 21 | 11 | 15 |
| Bending Strength (MPa) | 500 | 400 | 320 | 750 |
| Elasticity Modulus (GPa) | 340 | 350 | 320 | 300 |
| Thermal Conductivity (W/m*K) | 24 | 28 | 180 | 55 |
| Coefficient of Thermal Expansion (10⁻⁶/K) | 6.8-8.0 | 6.8-8.5 | 4.7-5.6 | 2.7 |
| Dielectric Strength (KV/mm) | 15 | 10 | 16 | 36 |
| Volume Resistivity (Ω*m) | >10¹² | >10¹² | >10¹² | >10¹² |
| Dielectric Constant | 9.8 | 9.9 | 8.9 | 8.5 |
Material Selection Guide & Key Applications
Aluminum Nitride (AlN) Substrates - The Ultimate Thermal Solution
Aluminum Nitride is renowned for its exceptional thermal conductivity, which is significantly higher than that of alumina. This makes it the premier choice for high-power and high-frequency electronics where efficient heat dissipation is paramount.
- Primary Applications:
- Thermal Management: Substrates for high-power LEDs, laser diodes, IGBT modules, and cooling devices. Ideal as insulating pads for transferring heat from components to heat sinks.
- Advanced Circuitry: Ceramic PCB dies, and substrates for thick-film/thin-film metallization.
- RF/Microwave: Precision substrates for microwave integrated circuits (MICs) with high-density features.
- Key Features:
- High Thermal Conductivity (180 W/m*K)
- Excellent Electrical Insulation
- Low CTE, matching well with silicon
- Available with polished surfaces for thin-film technology
Alumina (Al2O3) Substrates - The Cost-Effective Standard
Alumina ceramic offers the best balance of performance and cost, making it the most widely used substrate material. It provides high mechanical strength, hardness, and good thermal properties at a competitive price.
- Primary Applications:
- Standard Circuit Boards: Thick-film and thin-film ceramic PCBs.
- Sensors & Heaters: Bases for resistors, sensors, and heating elements.
- General Insulation: Wafers for ozonizers, protectors for piezoelectric elements, and general electronic insulation.
- Key Features:
- Excellent Cost-to-Performance Ratio
- High Mechanical Strength and Wear Resistance
- Good Thermal and Chemical Stability
- Available from 96% to 99.7% purity
Silicon Nitride (Si3N4) Substrates - The Mechanical Powerhouse
Silicon Nitride stands out for its exceptional fracture toughness and bending strength, making it the best choice for applications subjected to severe mechanical stress, thermal shock, and harsh environments.
- Primary Applications:
- High-Reliability Applications: Substrates for automotive and aerospace electronics.
- Thermal Cycle Resistance: Ideal for power modules undergoing frequent heating and cooling.
- Tough Thin Substrates: Enables the production of very thin (down to 0.3mm), yet robust substrates with low thermal resistance.
- Key Features:
- Very High Bending Strength (750 MPa)
- Superior Thermal Shock Resistance
- High Fracture Toughness and Wear Resistance
- Excellent Dielectric Strength
Why Choose Our Ceramic Substrates?
We specialize in manufacturing high-quality Alumina, Aluminum Nitride, and Silicon Nitride substrates tailored to your needs. Our capabilities include:
- Custom Geometry: Laser machining for precise shapes, holes, and grooves.
- Surface Finishes: From ground to laser-grade polished surfaces.
- Advanced Metallization: Thin-film and thick-film metallization options.
Searching for a reliable substrate? Contact us today to find the perfect material solution for your electronic circuit, thermal management, or high-power application.
Miss. Scarlett.S
Deputy Head of Foreign Trade Department
- Email: scarlett.s@kegugroup.com
- Tel: 8616602956098
- WhatsApp: 8613390790728
-
WeChat:
Scarlettseren533
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