High-Performance Silicon Carbide Furnace Components with Extreme Temperature Resistance, Superior Mechanical Strength, and Exceptional Thermal Management
Basic Properties
Place of Origin:
China
Brand Name:
KEGU
Model Number:
Customizable
Trading Properties
Price:
200-500 yuan/kg
Payment Terms:
L/C,D/A,D/P,T/T,Western Union,MoneyGram
Supply Ability:
2,000 pcs/month
Product Summary
Silicon Carbide (SiC) Furnace Components | Paddles, Boats & Tubes for Semiconductor & Solar Our Silicon Carbide (SiC) Furnace Components provide advanced ceramic solutions for demanding semiconductor and solar manufacturing processes. Engineered to withstand extreme temperatures up to 1900°C, these ...
Product Details
Highlight:
Silicon Carbide Ceramics Furnace
,85% Sic Paddle
,85% Sic Tube
Material:
SiC
Composition:SiC:
＞85%
Color:
Black
Density:
≥3.0g/cm3
Max. Service Temp:
1380℃
Flexural Strength:
250MPa
Product Description
Silicon Carbide (SiC) Furnace Components | Paddles, Boats & Tubes for Semiconductor & Solar
Our Silicon Carbide (SiC) Furnace Components provide advanced ceramic solutions for demanding semiconductor and solar manufacturing processes. Engineered to withstand extreme temperatures up to 1900°C, these high-purity components deliver superior thermal shock resistance, exceptional mechanical strength, and contamination-free performance - offering significantly longer service life and higher throughput compared to traditional quartz alternatives.
Core Product Line & Applications
- SiC Paddle: Robust wafer boat holder for diffusion processes
- SiC Boat: Wafer carrier for boron/phosphorus diffusion in discrete semiconductor manufacturing
- SiC Dragon Wafer Boat: Specialized holder for high-temperature diffusion applications
- SiC Process Tube: Critical component for diffusion furnace systems
Key Technical Advantages
- Extreme Temperature Performance: Maintains structural integrity and chemical stability at 1900°C operating temperatures
- Superior Mechanical Properties: High flexural strength (up to 420 MPa) prevents deformation under heavy thermal loads
- Exceptional Thermal Management: Outstanding thermal shock resistance ensures reliability during rapid thermal cycling
- Ultra-High Purity Construction: Resists acid/alkali corrosion, preventing wafer contamination in sensitive processes
- Optimized Thermal Conductivity: Ensures uniform temperature distribution for consistent process results
Technical Performance Specifications
| Performance Parameter | UNIT | HS-A | HS-P | HS-XA |
|---|---|---|---|---|
| Grain Size | μm | 4-10 | 4-10 | 4-10 |
| Density | g/cm³ | ≥3.1 | 3.0-3.1 | >3.1 |
| Hardness (Knoop) | Kg/mm² | 2800 | 2800 | 2800 |
| Flexural Strength @ RT | MPa | 385 | 240 | 420 |
| Compressive Strength @ RT | MPa | 3900 | - | 3900 |
| Modulus of Elasticity @ RT | GPa | 410 | 400 | 410 |
| Fracture Toughness @ RT | MPa*m¹/² | 8 | 8 | 8 |
| Max. Service Temp. (Air) | °C | 1900 | 1900 | 1900 |
| Thermal Conductivity @ RT | W/m*K | 125.6 | 110 | 125.6 |
Primary Industrial Applications
- Semiconductor Manufacturing: Diffusion, CVD, and high-temperature processing
- LED Production: Epitaxial growth and wafer processing applications
- Solar Energy: Photovoltaic cell diffusion furnace systems
- Discrete Power Devices: Boron and phosphorus diffusion processes
Competitive Advantages
- Quality Assurance: Rigorous quality control ensures consistent performance across all batches
- Custom Engineering: Expertise in manufacturing components to precise customer specifications
- Reliable Delivery: Efficient production systems designed to meet critical project timelines
- Technical Support: Comprehensive application engineering and customer service
Miss. Scarlett.S
Deputy Head of Foreign Trade Department
- Email: scarlett.s@kegugroup.com
- Tel: 8616602956098
- WhatsApp: 8613390790728
-
WeChat:
Scarlettseren533
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