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Product Details:
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| Material: | SiC | Composition:SiC: | >85% |
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| Color: | Black | Density: | ≥3.0g/cm3 |
| Max. Service Temp: | 1380℃ | Flexural Strength: | 250MPa |
| Highlight: | Silicon Carbide Ceramics Furnace,85% Sic Paddle,85% Sic Tube |
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Product Description
Our Silicon Carbide (SiC) Furnace Components provide advanced ceramic solutions for demanding semiconductor and solar manufacturing processes. Engineered to withstand extreme temperatures up to 1900°C, these high-purity components deliver superior thermal shock resistance, exceptional mechanical strength, and contamination-free performance - offering significantly longer service life and higher throughput compared to traditional quartz alternatives.
Core Product Line & Applications
SiC Paddle: Robust wafer boat holder for diffusion processes
SiC Boat: Wafer carrier for boron/phosphorus diffusion in discrete semiconductor manufacturing
SiC Dragon Wafer Boat: Specialized holder for high-temperature diffusion applications
SiC Process Tube: Critical component for diffusion furnace systems
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Key Technical Advantages
Extreme Temperature Performance: Maintains structural integrity and chemical stability at 1900°C operating temperatures
Superior Mechanical Properties: High flexural strength (up to 420 MPa) prevents deformation under heavy thermal loads
Exceptional Thermal Management: Outstanding thermal shock resistance ensures reliability during rapid thermal cycling
Ultra-High Purity Construction: Resists acid/alkali corrosion, preventing wafer contamination in sensitive processes
Optimized Thermal Conductivity: Ensures uniform temperature distribution for consistent process results
Technical Performance Specifications
| Performance Parameter | UNIT | HS-A | HS-P | HS-XA |
|---|---|---|---|---|
| Grain Size | μm | 4-10 | 4-10 | 4-10 |
| Density | g/cm³ | ≥3.1 | 3.0-3.1 | >3.1 |
| Hardness (Knoop) | Kg/mm² | 2800 | 2800 | 2800 |
| Flexural Strength @ RT | MPa | 385 | 240 | 420 |
| Compressive Strength @ RT | MPa | 3900 | - | 3900 |
| Modulus of Elasticity @ RT | GPa | 410 | 400 | 410 |
| Fracture Toughness @ RT | MPa·m¹/² | 8 | 8 | 8 |
| Max. Service Temp. (Air) | °C | 1900 | 1900 | 1900 |
| Thermal Conductivity @ RT | W/m·K | 125.6 | 110 | 125.6 |
Primary Industrial Applications
Semiconductor Manufacturing: Diffusion, CVD, and high-temperature processing
LED Production: Epitaxial growth and wafer processing applications
Solar Energy: Photovoltaic cell diffusion furnace systems
Discrete Power Devices: Boron and phosphorus diffusion processes
Competitive Advantages
Quality Assurance: Rigorous quality control ensures consistent performance across all batches
Custom Engineering: Expertise in manufacturing components to precise customer specifications
Reliable Delivery: Efficient production systems designed to meet critical project timelines
Technical Support: Comprehensive application engineering and customer service
Contact Person: Ms. Yuki
Tel: 8615517781293