High-Corrosion Resistance Silicon Carbide Ceramic Components for Semiconductor Applications in 200mm/300mm HDPCVD Domes
Basic Properties
Place of Origin:
China
Brand Name:
KEGU
Model Number:
Customizable
Trading Properties
Minimum Order Quantity:
Negotiable
Price:
Negotiable
Payment Terms:
L/C,D/A,D/P,T/T,Western Union,MoneyGram
Product Summary
High-Corrosion Resistance Industrial Ceramic Parts: HDPCVD Domes & Components Advanced Ceramic Solutions for Demanding Semiconductor Applications Our high-performance industrial ceramic components are engineered for extreme environments in semiconductor manufacturing, including HDPCVD (High-Density ...
Product Details
Highlight:
High-Corrosion Resistance Silicon Carbide Ceramic Components
,Semiconductor Applications HDPCVD Dome
,200mm/300mm Configurations Industrial Ceramic Parts
Usage:
Industry Usage
Chemical Composition:
Al2O3, SiO2
Sic Content:
85%
Maximum Temperature:
1600℃
Characteristics:
High Wear Resistance
Thermal Expansion Coefficient:
4.0-4.5 × 10^-6 /K
Material Composition:
4%Si >96%Sic
Working Temperature:
1650
Advantage:
Wear And Abrasion Resistance
Purity:
98%
Material:
Silicon Carbide Ceramic
Acid Alkaline Proof:
Excellent
Solubility:
Insoluble
Open Porosity:
<0.1%
Flexural Strength:
350-550 MPa
Product Description
High-Corrosion Resistance Industrial Ceramic Parts: HDPCVD Domes & Components
Advanced Ceramic Solutions for Demanding Semiconductor Applications
Our high-performance industrial ceramic components are engineered for extreme environments in semiconductor manufacturing, including HDPCVD (High-Density Plasma Chemical Vapor Deposition) processes. Available in multiple material options to meet specific thermal, mechanical, and corrosion resistance requirements.
Our high-performance industrial ceramic components are engineered for extreme environments in semiconductor manufacturing, including HDPCVD (High-Density Plasma Chemical Vapor Deposition) processes. Available in multiple material options to meet specific thermal, mechanical, and corrosion resistance requirements.
HDPCVD Dome Products
Available Types & Specifications:
- Standard HDP Dome: 200mm / 300mm configurations
- SpeedDome: Optimized for high-throughput processes
- DPS Dome: Enhanced plasma resistance designs
- Custom Roughness: Inner contour surface finish from Ra 0.5 to Ra 5.3
- Key Benefits: Prevents film shedding, minimizes particle contamination, compatible with various process requirements
Material Selection Guide
| Property | Alumina (Al₂O₃) | Aluminum Nitride (AlN) | Zirconia (ZrO₂) | Silicon Carbide (SiC) | Sapphire (Single Crystal Al₂O₃) |
|---|---|---|---|---|---|
| Density (g/cm³) | 3.9 | 3.3 | 6.0 | 3.21 | 3.97 |
| Hardness (GPa) | 14-17 | 10-12 | 13 | 27-28 | 22.5 |
| Elastic Modulus (GPa) | 350-400 | 300-350 | 200-250 | 420-470 | 440-690 |
| Fracture Toughness (MPa*m¹/²) | 3-4 | 2.8-3.3 | 10-11 | 3.5-3.6 | 2.6 |
| Thermal Conductivity (W/m*K) | 28-32 | 180-200 | 2-3 | 160-200 | 40 |
| Thermal Shock Resistance | 200-280°C | Excellent | 300°C | Excellent | 800°C |
| Dielectric Constant (1MHz) | 9.8 | 8.5-9 | 30-33 | Conductive | 9.3 |
| Volume Resistivity (Ω*cm) | >10¹⁴ | >10¹⁴ | Adjustable | Varies | >10¹⁴ |
Key Material Advantages
Alumina (Al₂O₃)
- Excellent chemical stability and corrosion resistance
- High hardness and wear resistance
- Ideal for wear components, insulating substrates, corrosion-resistant containers
Aluminum Nitride (AlN)
- Superior thermal conductivity for heat dissipation
- Excellent electrical insulation properties
- Perfect for electronic heat sinks, high-power device packaging
Zirconia (ZrO₂)
- Exceptional fracture toughness
- Transformation toughening mechanism
- Suitable for cutting tools, oxygen sensors, fuel cells
Silicon Carbide (SiC)
- Extreme hardness and thermal conductivity
- Excellent for ballistic armor, high-temperature bearings, semiconductor components
Sapphire (Single Crystal Al₂O₃)
- Optical transparency combined with high hardness
- Superior thermal shock resistance
- Ideal for specialized optical and extreme environment applications
Performance Features
- Superior Corrosion Resistance: Withstands aggressive chemical environments in semiconductor processing
- Minimal Particle Generation: Engineered surfaces reduce contamination in cleanroom environments
- Customizable Surface Properties: Tailored roughness and finishing to meet specific process requirements
- Thermal Stability: Maintains dimensional integrity under rapid thermal cycling
- Electrical Insulation: Excellent dielectric properties for plasma applications
Applications
- Semiconductor Processing: HDPCVD chambers, etch components, plasma environments
- Electronic Packaging: Heat spreaders, insulating substrates
- Industrial Components: Wear-resistant parts, corrosion-resistant containers
- Advanced Research: Specialized laboratory equipment, optical components
Miss. Scarlett.S
Deputy Head of Foreign Trade Department
- Email: scarlett.s@kegugroup.com
- Tel: 8616602956098
- WhatsApp: 8613390790728
-
WeChat:
Scarlettseren533
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